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Development of No-Flow Underfili Materials for Lead-Free Solder Bumped Flip-Chip Applications by
  • Zhang, Z
  • Shi, S. H
  • Wong, C. P
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Study OfFluxing Agent Effects onProerties of No-Flow Underfili Materials for Flip-Chip Applications by
  • Shi, S. H
  • Wong, C. P
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Request article
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