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Case Study of Ground Plane Inductance and Impications for Simulation by
  • Young, Brian
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Return Path Inductance in Measurements of Package Inductance Matrixes by
  • Young, Brian
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Design of Homologous Ram Pumps. by
  • Young, Brian
Source: Transactions ofAsme, Journal of Fluids Engineering
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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