Your search returned 4 results.

Results
		Fatigue life Estimation of Surface Mount Solder Joints by Xie, D Hui, I. K Lai, J. K. L Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Fatigue life Studies on Defect-Free Solder Joints Fabricated from Modified Reflow Soldering by Xie, D Chan, Yan C Lai, J. K. L Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Application of Direct Strain Measurement to Fatigue Studies in Surface Solder Joints by Chan, Yan C Lai, J. K. L Hui, I. K Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Aging Studies of Cu-Sn Intermetalilc Compounds in Annealed Surface Mount Solder Joints by So, Alex C. K Lai, J. K. L Chan, Yan C Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

Refine your search