Your search returned 2 results.

Sort
Unhighlight Highlight
Select all Clear all
Select titles to:
Results
Multilayer Ceramic Packaging Alternatives by
  • Sprague, John L
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Request article
Mechanism of Electromigration in Ceramic Packages Induced by Chip-Coating Polyimide by
  • Mashiko, Youji
  • Kohara, Masanobu
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Request article
Pages