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Microstructural Evolution in Sn/Pb Solder and Pb/Ag Thick Film Conductor Metalilzation by
  • liu, Kuo-Chuan
  • Duh, Jenq-Gong
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Temperature Cycling Effects Between Sn/Pb Solder and Thick Film Pd/Ag Conductor Metalilzation by
  • Chiou, Bi-Shiou
  • liu, K. C
  • Duh, Jenq-Gong
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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