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Study onPressurized Underfili Encapsulation of Flip Chips by
  • Han, Sejin
  • Wang, K. K
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Modeling of Dam Break Wave Propagation in A Partially Ice-Covered Channel by
  • Fuamba, Musandji
  • Bouaanani, Najib
Source: Advances in Water Resources
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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