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Long Lossy lines (L3) and Their Impact Upon Large Chip Performance by
  • Davidson, Evan E
  • Mccredie, Bradley D
  • Vilkelis, Valter V
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Submicron Rie Recessed Ingap/Ingaas Doped-Channel Fets by
  • Chan, Yi-Jen
  • Wang, Wen-Kai
  • Yang, Shih-Cheng
Source: Ieee Transactions on Electron Devices
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Magnetic and Microstructure Study of Bulk (Sm Eu Gd)Ba2 Cu3 Oy with Submicron Gd2bacuo5 Second -Phase Particles by
  • Muralidhar, K
Source: Journal of Materials Research
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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