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		A Novel Transient Simulation for 3-D Multilevel Interconnetions on Complex Topography by Hou, Hsin-Ming Sheen, C. S Wu, C. Y Source: IEEE Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Review OfSkin Effect as Applied to Thin Film Interconnections by Hwang, lih-Tyng Turlik, Lwona Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		on-Line Test for Fault-Secure Fault Identification. by Orailoglu, A Hamilton, S. N Source: Ieee Transactions on Very Large Scale Intergration (Vlsi) Systems Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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