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		Guidelines for High-Performance Electronic Package Interconnections Approach for Strong Coupling by Yang, Yang Brews, J. R Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		New Metrics and Scheduling Rules for Disassembly and Bulk Recycling by Stuart, Julie Ann Christina, Vivi Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		How Well Can We Assess Thermally Driven Reliability Issues in Electronic Systems today? Summary of Panel Held AtTherminic 2002 by Azar, K Blackburn, D.L Source: Microelectronics Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Systems on A Chip:Next Electronic Frontier by Lavagno, Luciano Source: Ieee Micro:The Magazine for Chip & Silicon Systems Designers Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Analysis and Design of A High Power Factor, Single-Stage Electronic Ballastr for High -Intensity Discharge Lamps by Martin, F Source: Ieee Transactions on PowerElectronics Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Encryption Wars: Elrly Battles by Coloyannides, Michael A Source: Ieee Spectrum Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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