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		Advanced Low-Cost Bare-Die Packaging Technology for liquid Crystal Displays by Hwang, Jackson C Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Tab Inner-Lead Bond Process Characterization Or Single-Point Laser Bonding by Wesling, Paul Emamjomeh, Ali Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		296 Lead Fine Pitch (0.4 Mm) Thin Plastic Qfp Package with Tab Interconnect by Jain, Praveen Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Investigations of Laser Soldered Tab Inner Lead Contacts by Zakel, Elke Reichl, Herbert Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Characteristics of Tab for Smali Systems by Bulier, Lawrence Mcnelis, Barbara Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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