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		Investigation on Device Characteristic of Mosfet Transistor Placed Under Bond Pad for High Pin Count Soc Applications by Ker, Ming-Dou Peng, Jeng-Jie Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Temperature Cycling Effects Between Sn/Pb Solder and Thick Film Pd/Ag Conductor Metalilzation by Chiou, Bi-Shiou liu, K. C Duh, Jenq-Gong Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Relation Between Delamination and Temperature Cycling Induced Failures in Plastic Packaged Devices by Van Doorselaer, Karel De Zeeuw, Kees Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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