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		Thermal Performance of an Mcm Flip-Chip Assembly in liquid Nitrogen by Ulrich, Richard K Rajan, Sanjay Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Ica Based Thermal Source Extraction and Thermal Distortion Compensation Method for A Mahine tool by Lee, D Source: International Journal of Machine tools & Manufacture: Design, Research and Application Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Note onEffect of Thermal Distortion on Constriction Resistance by Rossmanith, H.P Source: International Journal of Heat and Mass Transfer Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Effect of Thermal Distortion on Constriction Resistance by Barber, J.R Source: International Journal of Heat and Mass Transfer Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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