Your search returned 2 results.

Sort
Unhighlight Highlight
Select all Clear all
Select titles to:
Results
Thermal Performance of an Mcm Flip-Chip Assembly in liquid Nitrogen by
  • Ulrich, Richard K
  • Rajan, Sanjay
Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Request article
Optimization OfThermal Design of a Cryogenicaliy Cooled Computer by
  • anderson, James C
  • Krane, Robert J
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Request article
Pages