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Mcm-L Technology a Systems Cost Analysis for a High Volume Automotive Electronics Application by
  • Evans, John L
  • Bosley, Larry E
  • Johnson, R. Wayne
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Low-Cost Multichip Modules by
  • Dobers, Michael
  • Seyffert, Martin
Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Recent Advancein Mining Haul Trucks by
  • Koellner, Walter G
Source: IEEE Transactions on Industrial Electronics
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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