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Model for Bga and Csp Relibility in Automotive Underhood Applications by
  • Lali, Pradeep
  • Islam, Mohd Nokibul
  • Darveaux, Robert
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Thermal Performance Comparison of High Pin Count Cavity-Up Enhanced Plastic Bali Grid Array (Epbga) Packages by
  • Mertol, Atila
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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