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		Electroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps by Chen, Chun-Jen lin, Kwang-Lung Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Material Interactions of Solder Bumps Produced with Fluxless Wave Soldering by lin, Kwang Lung Chao, Wen-Hsiuan Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		ImprovimgElectrical Integrity of Cu-Cosi2 Contacted N+P Junction Diodes Using Nitrogen-Incorporated Ta Films As A Diffusion Barrier by Yang, Wei-Bin Source: Ieee Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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