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Transient Thermal Analysis of an Acf Package Assembly Process by
  • Chiriac, Victor Adrian
  • Lee, Tien-Yu Tom
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Stress-De for mation Behavior Under Anisotropic Drained Triaxial Consolidation of Cement-Treated Soft Bangkok Clay by
  • Bergado, D. T
Source: Soils and Foundations
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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