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		A Method to ImproveEfficiency of Cmp Process by Shaw, D. G Chang, Jassy Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Physical and Electrical Effects of Metal-Fili Patterning Practices for Oxide Chemical-Mechanical Polishing Processes by Stine, Brian E Boning, Duane S Muthukrishnan, Moorthy Source: IEEE Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Physical and Electrical Effects of Metal-Fili Patterning Practices for Oxide Chemical-Mechanical Processes by Stine, Brian E Boning, Duane S Berman, Michael Source: IEEE Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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