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		Statistics of Electric Conductance through Anisotropicaliy Conductive Adhesive by Fu, Ying Wiliander, Magnus liu, Johan Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Reliable and Environmentaliy Friendly Packaging Technology Flip Chip Joining Using Anisotropicaliy Conductive Adhesive by liu, Johan Malmodin, Jens Lai, Zonghe Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Mechanism of Electrical Conduction through Anisotropicaliy Conductive Adhesive Films by Mizuno, Masuo Saka, Masumi Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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