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		Rf Electrical Measurements of Fine Pitch Bga Packages by Caggiano, Michael F Ou, Jack lischner, David Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Advanced Process Characterization for 125 Khz Wire Bonder Ultrasonic Transducers by Parrini, Lorenzo Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Failure Mechanism Study of Anisotropic Conductive Film (Acf) Packages by Mercado, Lei L White, Jerry SARihan, Vijay Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Modeling and Experimental Measurements of Strain Distribution in Asphalt Mixes by Somadevan, Niranjanan Bahia, Hussain U Kose4, Sadi Masad, Eyad Source: Asce: Journal of Transportation Engineering Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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