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		Design and Performance Evaluation of a Compact Thermosyphon by Pal, A Joshi, Yogendra K Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Experimental Study onPerformance of Miniature Heat Pipes with Woven-Wire Wick by Moon, Seok Hwan Yun, Ho Gyeong Hwang, Gunn Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Spreading InHeat Sink Base Phase Change Systems Or Solid Metals by Sauciuc, Loan Mahajan, R. L Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Assessment of High-Heat Flux Thermal Management Schemes by Mudawar, I Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Channel Width on Pool Boiling from a Microconigured Heat Sink by Noweli, Ronald M Bhavnani, Sushil H Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Experimental Investigation Subcooled liquid Nitrogen Impingement Cooling of a Silicon Chip by Vader, David T Chrysler, Gregory Simons, Robert E Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Evaluation of a Powerpc 620 Microprocessor in a Multiprocessor Computer by Wong, Henry Lee, Tien-Yu Tom Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Design and Optimization of Pin Fin Heat Sinks for Low Velocity Applications by Shaukatuliah, H Storr, Wayne R Gaynes, Michael A Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Characterization of Compact Electronic System: A Portable Pc As A Study Case by Dallago, E Venchi, G Source: Ieee Transactions on PowerElectronics Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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