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Thermal Issues in Mems and Microscale Systems by
  • Devoe, Don L
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Arrhenius Average TemperatureEffective Temperature for Non-Fatigue Wearout and Long Term Reliability in Variable Thermal Conditions and Climates by
  • Tencer, Michal
  • Moss, John Seaborn
  • Zapach, Trevor
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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