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		Catio3-Modified [(K0.5na0.5)0.94li0.06](Nb0.94sb0.06)O3 Lead-Free Piezoelectric Ceramics with Improved Temperature Stability by Wu, Jiagang Source: Scripta Materialia Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Formation and Growth Kinetics of Interfacial Intermetalilcs in Pb-Free Solder Joint by li, G Chen, B. L Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		New Design for a Lead Frame Used for High Pin Counts and High-Power Lsi Package by Mita, Mamoru Takagi, Shoji Tanaka, Hiroki Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A New Bumping Process Using Lead-Free Solder Paste by Sugawara, toshiharu Saito1, K Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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