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The First Law of Thermodynamics and Energy Partition InPresence of Fields by
  • Zimmels, Y
Source: The Canadian Journal of Chemical Engineering
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Thermosonic Flip-Chip Bonding Using Longitudinal Ultrasonic Vibration by
  • Tan, Qing
  • Schaible, Brian
  • Bond, Leonard J
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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