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		Knit-In 3d Mapping'S Effect on Thermoregulation: Preliminary Results by Kinnicutt, Patrick Domina, Tanya Macgililvray, Maureen Source: The Journal OfTextile Institute Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Coupling in Integrated Circuits: Application to Thermal Testing by Altet, Josep Rubio, Antonio Schaub, Emmanuel Source: IEEE Journal of Solid-State Circuits Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		An Analysis of Two-Heater Active Thermal Control Technology Fo Device Testing by Wan, J. W Zhang, W. J Torvi, David Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Development of Jedec Standard Thermal Measurement Test Boards by Edwards, Darvin Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Properties and Ohysiological Responses of Vapor-Permeable Water-Repellent Fabrics Treated with Microcapsule -Containing Pcms by Chung, Hyejin Source: Textile Research Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		New Possibilities InThermal Evaluation , offered By Transient Testing by Rencz, Marta Source: Microelectronics Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Four Different Approaches for Measurement of Ic Surface Temperature: Application to Thermal Testing by Altet, Josep Source: Microelectronics Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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