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		Thermal Analysis of Air-Cooled Pem Fuel Celis by Shahsavari, Setareh Desouza, andrew Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Hydrogen Production of Two-Stage Temperature Steam Re Former Integrated with Pbi Membrane Fuel Celis to Optimize Thermal Management by Weng, Fangbor Cheng, Chih-Kai Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Simulation of an Innovative Polymer Electrolyte Membrane Fuel Celi Design for Self-Control Thermal Management by Bates, Alex Hwang, Sunwook Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Analyzing a Micro-Solid Oxide Fuel Celi System by Global Energy Balances by Meier, Christoph Hocker, Thomas Gauckler, Ludwig J Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Management of a Proton Exchange Membrane Fuel Celi Stack with Pyrolytic Graphite Sheets and Fans Combined by Wen, Chih lin, Yu-Shan Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Matching of Water and Temperature Fields in Proton Exchange Membrane Fuel Celis with Non-Uni Form Distributions by Yang, Xiao Cuang Cheng, P Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Chalienges in Next Generation Electronic Ststems-Summary of Panel Presentations and Discussions by Garimelia, Suresh V Joshi, Yogendra K Toh, C.-K Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Computational Parameter Study of Chip Scale Package Array Cooling by Watson, Sean P Murray, Bruce T Sammaki, Bahgat G Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Characterization of a liquid Cooled Aisic Base Plate with Integral Pin Fins by Moores, Kevin A Joshi, Yogendra K Schiroky, Gerhard H Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Immersion-Cooled Heat Sinks for Electronices Insight from High Speed Photography by Bhavnani, Sushil H Jaeger, Richard C Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Performance of an Mcm Flip-Chip Assembly in liquid Nitrogen by Ulrich, Richard K Rajan, Sanjay Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Evolution of Ibm High Performance Cooling Technology by Simons, Robert E Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Substrate Temperatures of liquid Nitrogen Cooled Multichip Modules Utlizing Wirebonded Die by Ulrich, Richard K Rajan, Sanjay Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Transient Thermal Management of Portable Electronics Using Heat Storage and Dynamic Power Dissipation Control by Cao, lipeng Fisher, Timothy S Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Development of Jedec Standard Thermal Measurement Test Boards by Edwards, Darvin Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Management Control with out Overshoot Using Combinations of Boiling liquids by Mahalingam, Mali Lee, T.Y. Tom Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Low Temperature Co-Fired Glass Ceramic High Density Interconnect Substrate with Improved Thermal Management by Martin, Angela J Rich, lil, Edward L Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Characterizing Heat Transfer within A Commercial-Grade Tubular Solid Oxide Fuel Cell for Enhanced Thermal Management by Haynes, Comas Wepfer, William J Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Family of Thermal Nomograms for Mass Concrete by J. Brown L. E. Al-Hasani J. Park K. E. Kurtis R. Gentry Y. K. Cho Source: ACI Materials Journal Material type: Article; Format: print Online access: Click here to access online Availability: Items available for loan: Periodical Section (1). Request article

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