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		Diopside-Ba Disilicate Glass-Ceramic Sealants for Sofcs: Enhanced Adhesion and Thermal Stability by Sr for Ca Substitution by Reddy, Aliu Amarnath Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Diopside - Mg Orthosilicate and Diopside - Ba Disilicate Glass-Ceramics for Sealing Applications in Sofc: Sintering and Chemical Interactions Studies by Reddy, Aliu Amarnath Goel, Ashutosh Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		In-Place Modulus of Elasticity for High-Performance Concrete Bridge by Hughs, Erin A liang, Zhiyong Source: ACI Materials Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Nonconduction Filier Additions on Aca Properties andReliability of Aca Flip Chip on Organic Substrates by Yim, Myung-Jin Paik, Kyung-Wook Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Fili Pattern and Particle Distribution of Underfili Material by Huang, L. D Huang, Yue Feliow, Michael G. Pecht Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effective Material Properties and Themal Stress Analysis of Epoxy Molding Compound in Electronic Packaging by Shin, Dong-Kwang Lee, Jung-Ju Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		linear Fracture Mechanics Analysis on Growth of Interfacial Delamination in Lsi Plastic Packages Under Temperature Cyclic Loading by Saitoh, Takehiro Matsuyama, Hidehito Toya, Masayuki Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Precision Capacitance Cell for Measurement of Thin Film Out-of-Plane Expansion-Part Iii: Conducting and Semiconducting Materials by Snyder, Chad R Source: Ieee Transactions on Instrumentation and Measurement Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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