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Optoelectronic Packaging by
  • Mickelson, Alan R [editor]
  • Lee, Yung-Cheng [editor]
Series: Wiley Series in Microwave and Optical Engineering
Material type: Text Text
Language: English
Publication details: New York : John Wiley, c1997
Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.381045 MIC.
Thermosonic Bonding of an Optical Transceiver Based on an 8×8 Vertical Cavity Surface Emitting Laser Array by
  • Mclaren, Timothy S
  • Kang, Sa Yoon
  • Lee, Yung-Cheng
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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