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Chain: A Delay-Insensitive Chip Area Interconnect by
  • Bainbridge, C. M
Source: Ieee Micro:The Magazine for Chip & Silicon Systems Designers
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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A Path - Independent Integral for Stess Intensity Factors in Three Dimensions. by
  • Rooke, D. P
  • Bainbridge, C. M
Source: The Journal of Strain Analysis for Engineering Design
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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