Low-Temperature Capacitor-Over-Interconnect (Coi) Modular Feram for Soc Application

By: Material type: ArticleArticleDescription: 920-926 pSubject(s): In: Ieee Transactions on Electron Devices
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.51, No.06 (Jun. 2004) Available