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Process and Reliability of Air-Gap Cu Interconnect Using 90-Nm Node Technology by
  • Noguchi, Junji
Source: Ieee Transactions on Electron Devices
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Integration and Reliability of Cu-Sioc Interconnect for Arf/90-Nm Node Cmos Technology by
  • Noguchi, Junji
  • Oshima, Takayuki
Source: Ieee Transactions on Electron Devices
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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