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The Impact of Packaging onReliability of Flip-Chip Solder Bonded Devices by
  • Lodge, Kevin J
  • Pedder, David J
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Prototype Packages in Aluminum Nitride for High Performance Electronic Systems by
  • Sparrow, John A
  • Lodge, Kevin J
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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