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Encapsulant for Nonhermetic Multichip Packaging Applications by
  • lin, A.W
  • Wong, Ching-Ping
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Evaluation of Polyimides as Dielectric Materials for Multichip Packages with Multilevel Interconnection Structure by
  • lin, A.W
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Enhanced Moisture Protection of Electronic Devices by Ultra-Thin Polyimide Films by
  • lin, A.W
  • Burack, John J
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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