Your search returned 2 results.

Sort
Unhighlight Highlight
Select all Clear all
Select titles to:
Results
Enhancement of Flip-Chip Fatigue life by Encapsulation by
  • Suryanarayana, Darbha
  • Mccreary, Jack M
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Request article
Encapsulants Used in Flip-Chip Packages by
  • Suryanarayana, Darbha
  • Wu, Tien H
  • Varcoe, Jack A
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Request article
Pages