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Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading Part lil Material Properties and Package Geometries by
  • Saitoh, Takehisa
  • Toya, M
  • Matsuyama, Y
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Energy Release Rates for an Interface Crack Embedded in A Laminated Beam Subjected to Three-Point Bending. by
  • Chosa, A
  • Aritomi, M
  • toya, M
Source: Transactions ofAsme, Journal of Applied Mechanics
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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