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A Wafer Level Testability Approach Based on an Improved Scan Insertion Technique by
  • Bolchini, C
  • Buonanno, G
  • Buonanno, Giacomo
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Experimental and Theoritical Modeling ofEffective Thermal Conductivity of Rough Steel Spheroid Packedbeds by
  • Buonanno, G
  • Carotenuto, A
Source: Transactions ofAsme, Journal of Heat Transfer
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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