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Development of 0.45-Mm Thick Ultra-Thin Smali Outline Package by
  • Omi, Susumu
  • Maruyama, Tomoyo
  • Maeda, Takamichi
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Causes of Cracks in Smd and Type Specific Remedies by
  • Omi, Susumu
  • Fujita, Kazuya
  • Maeda, Takamichi
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Development of Copper Wire Bonding Application Technology by
  • Fujita, Kazuya
  • Maeda, Takamichi
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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