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		Power Cycling and Stress Variation in a Multichip Module by Sur, Biswajit Turlik, Lwona Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		An Extended Time-Domain Network Analysis Measurement Technique by Hwang, lih-Tyng Rinne, Glenn A Turlik, Lwona Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Review OfSkin Effect as Applied to Thin Film Interconnections by Hwang, lih-Tyng Turlik, Lwona Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Comparative Evaluation of Optical Waveguides as Alternative Interconnections for High Performance Packaging by Hwang, lih-Tyng Mccredie, Bradley D Turlik, Lwona Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thin-Film Pulse Propagation Analysis Using Frequency Techniques by Hwang, lih-Tyng Turlik, Lwona Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Simulation and Design of Lossy Transmission lines in a Thin-Film Multichip Package by Hwang, lih-Tyng Turlik, Lwona Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effects of Polymer/Metal Interaction in Thin-Film Multichip Module Applications by Turlik, Lwona Hwang, lih-Tyng Rinne, Glenn A Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Shear Deformation of Indium Solder Joints by Darveaux, Robert Turlik, Lwona Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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