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3d-Waspj Devices for on-line Signal and Data Processing by
  • Hedge, S. J
  • Habiger, C. M
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Cost-Effective Multichip Module Manufacture Using Passive Substrate Fault Tolerance by
  • Peacock, Christopher
  • Bolouri, H
  • Habiger, C. M
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Request article
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