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		An Assessment OfThermal Performance OfPbga Family by Mulgaonker, Shailesh Chambers, B Mahalingam, Mali Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Application of Cfd Technology to Electronic Thermal Management by Lee, Tien-Yu Tom Mahalingam, Mali Chambers, B Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal limits of Flip Chip Package Experimentaliy Valisated Cfd Supported Case Studies by Tom Lee, Tien-Yu Mahalingam, Mali Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Design Space Prediction in Two-Phase Direct liquid Cooling by Lee, T.Y. Tom Mahalingam, Mali Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Management Control with out Overshoot Using Combinations of Boiling liquids by Mahalingam, Mali Lee, T.Y. Tom Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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