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Reliability Studies of Surface Mount Solder Joints - Effect of Cu-Sn Intermetalilc Compounds by
  • So, Alex C. K
  • Chan, Yan C
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Aging Studies of Cu-Sn Intermetalilc Compounds in Annealed Surface Mount Solder Joints by
  • So, Alex C. K
  • Lai, J. K. L
  • Chan, Yan C
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Request article
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