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Thermal Performance of an Mcm Flip-Chip Assembly in liquid Nitrogen by
  • Ulrich, Richard K
  • Rajan, Sanjay
Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Substrate Temperatures of liquid Nitrogen Cooled Multichip Modules Utlizing Wirebonded Die by
  • Ulrich, Richard K
  • Rajan, Sanjay
Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Request article
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