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		Theroy of Fault-Based Predicate Testing for Computer Programs by Tai, K Source: IEEE Transactions on Software Engineering Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		High Q-Factor Inductors Integrated on Mcm Si Substrates by Tai, K Zu, Larry Sandy, Sheue-Chyn Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Use of Sequencing Constraints for Specification-Based Testing of Concurrent Programs by Carver, R H Tai, K Source: IEEE Transactions on Software Engineering Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		S Parameter-Based Experimental Modeling of High Q Mcm Inductor with Exponential Gradient Learning Algorithm by Zhao, Jian Frye, Robert C Tai, K Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Low-Cost Error Containment and Recovery for onboard Guarded Software Upgrading and Beyond by Tai, K Source: IEEE TransactionsonComputers Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Incremental Integration Testing of Concurrent Programs by Koppol, P V Carver, R H Tai, K Source: Ieee Transactions on Software Engineering Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Numerical Study of Some Approaches to Shape Design Sensitivity Analysis Using. by Tai, K Fenner, R. T. F Source: The Journal of Strain Analysis for Engineering Design Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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