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Lead-Free Soldering InJapanese Electronics Industry by
  • Fukuda, Yuki
  • Pecht, Michael G
  • Fukuda, K
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Evaluation of Selected Japanese Lead-Free ConsumerElectronics by
  • Fukuda, Yuki
  • Pecht, Michael
  • Casey, Paul
Source: Ieee Transactions onElectronics Packaging Manufacturing
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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