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Evaluation of Polymeric Coatings for Mcm Applications by
  • KoDNAni, Ramesh
  • Jaffe, Donald
  • Jaccodine, Ralph
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Formation of Voids in Silicone Rtv Dispersion Under Beam-Leaded Silicon Integrated Circuits by
  • Jaffe, Donald
  • Owczarek, Jerzy A
  • Howland, Frank L
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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