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		Application OfTaguchi Method onRobust Design of Molded 225 Plastic Bali Grid Array Packages by Mertol, Atila Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Performance Comparison of High Pin Count Cavity-Up Enhanced Plastic Bali Grid Array (Epbga) Packages by Mertol, Atila Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Optimization of High Pin Count Cavity Up Enhanced Plastic Bali Grid Array (Epbga) Packages for Robust Design by Mertol, Atila Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Transient, Steady State and Stability Behavior of A Thermosyphon with Throughflow by Mertol, Atila Greif, R Zvirin, Y Source: International Journal of Heat and Mass Transfer Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Study ofVariation ofPressure in A Natural Circulation Loop by Mertol, Atila Greif, R Lavine, A Source: International Journal of Heat and Mass Transfer Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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