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		Molecular Basis OfInterphase Dielectric Properties of Microelectronic and Optoelectronic Packaging Materials by Todd, Micheal G Shi, Frank G Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Validation of A Novel Dielectric Constant Simulation Model andDetermination of Its Physical Parameters by todd, Micheal G Shi, Frank G Source: Microelectronics Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		towards Model-Based Engineering of Optoelectronic Packaging Materials Dielectric Constant Modeling by Wo, Hung T Shi, Frank G Source: Microelectronics Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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