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Exothermic Reaction Induced Eutectic Pb-Sn Solder Bali Melting InUnderfili Curing Process by
  • Kwon, Woon-Seong
  • Jang, Se-Young
  • Paik, Kyung-Wook
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Effects of Silica Filier and Diuent on Material Properties and Reliability of Nonconductive Pastes (Ncps) for Flip-Chip Applications by
  • Jang, Kyung-Woon
  • Kwon, Woon-Seong
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
Request article
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