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Moisture Ingress Into Organic Laminates by
  • Pecht, Michael G
  • Ardebili, Haleh
  • Shukla, Anand A
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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A Critique OfReliability Analysis Center Failure-Rate-Model for Plastic Encapsulated Microcircuits by
  • Shukla, Anand A
  • Pecht, Michael G
Source: IEEE Transactions on Reliability
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Criteria for Assessment of Reliability Models by
  • Pecht, Michael G
  • Shukla, Anand A
  • Kelkar, A. G
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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