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Electroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps by
  • Chen, Chun-Jen
  • lin, Kwang-Lung
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Wetting Interactions BetweenNi-Cu-P Deposit and In-Sn Solders by
  • Chen, Chun-Jen
  • lin, Kwang Lung
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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